MediaTek Hires Former TSMC Executive Douglas Yu to Boost AI Chip Packaging Capabilities

MediaTek appointed Douglas Yu, a 31-year TSMC veteran who retired in 2025, as a part-time adviser. Yu was one of TSMC's six R&D 'knights' and played a central role in developing CoWoS (Chip on Wafer on Substrate) and InFO (Integrated Fan-Out) advanced packaging technologies widely used in AI chips including Nvidia's. MediaTek expects multi-billion-dollar revenue from AI accelerator ASIC chips by 2027 and is competing against Broadcom for Google AI ASIC design orders. Yu's packaging expertise is seen as critical to winning these deals. MediaTek's stock surged 86% over the past month.